Daphna Nissenbaum to speak about Compostable Packaging at World Economic Forum in Davos

TIPA’s co-founder, Daphna Nissenbaum, discusses innovation and alternatives to

plastic at the World Economic Forum 2020


Hod Hasharon, Israel, January 17, 2020.


TIPA’s CEO and co-founder, Daphna Nissenbaum, is set to discuss innovation in response to worldwide plastic pollution at the World Economic Forum in Davos next week.

The World Economic Forum will be attended by speakers such as Greta Thunberg, Donald Trump and Angela Merkle in a bid to shape global agendas and work towards a cohesive and sustainable 2020.

Named as a Technology Pioneer by the World Economic Forum (WEF) in 2019, TIPA, who develop and produce compostable packaging, play a vital role in reducing the global production of plastic.

As part of this title, TIPA joins other SMEs who are involved in the design, development and deployment of new technologies and innovations that have a significant impact on the economy and society.

Contextualised by a world that is educated on the environmental consequences of plastic but yet to turn off the plastic tap, TIPA is set to discuss the innovations that can curb our reliance on plastic.

Whilst in Davos, Nissenbaum will explore and examine the policy, market and technological innovations that have developed with the sole purpose of stemming the tide of plastics.

Co-founded by Daphna Nissenbaum in 2010 to address the global problem of plastic waste, TIPA produce compostable packaging solutions for food, mail order, retail and luxury goods markets.


Daphna Nissenbaum speaker events:

  • Tuesday, January 21 at 9am: “Innovation for Impact: Reducing Waste through Compostable Packaging
  • Thursday 23rd at 12:30pm: “Solving the Plastics Puzzle” panel


About TIPA®

Inspired by nature, TIPA®’s compostable packaging solutions are designed to break down within months under compost conditions just like any organic matter, such as orange peels. TIPA® packaging provides solutions for the food and fashion industries, and is built to fit existing machinery and supply chains. The company’s packaging solutions are currently being implemented worldwide by leading global brands in Europe, Australia, and the US.

TIPA® has recently been named a ‘Technology Pioneer’ by the World Economic Forum, joining a prestigious list of companies from around the world involved in the design, development, and deployment of new technologies and innovations who are poised to have a significant impact on business and society.

About the World Economic Forum: The World Economic Forum, committed to improving the state of the world, is the International Organization for Public-Private Cooperation. The Forum engages key political, business and other societal leaders to coordinate global, regional and industry agendas. www.weforum.org

For more Information:

Visit www.tipa-corp.com
Email rebecca@tipa-corp.com